SAMs Process – Self Assembled Molecules
What is the SAM’s process and the benefits?
- A surface treatment (Post Plate) that forms a protective layer of “Self Assembled Molecules” on Gold, Silver and other plated surfaces.
- Precious metal thickness reduction and significant cost savings through enhanced corrosion, diffusion and wear resistance for electronic applications.
- Diffusion Barrier to intragranular and transgranular metallic contamination and modification. (Cu Migration
- Better solderability
- Thickness Reduction:
- 35% to 75% precious metal plating cost reduction with reduced thickness – produces equal or better performance