Reduce Precious Metal Plating Costs:


SAMs Process – Self Assembled Molecules

What is the SAM’s process and the benefits?

  • A surface treatment (Post Plate) that forms a protective layer of “Self Assembled Molecules” on Gold, Silver and other plated surfaces.
  • Precious metal thickness reduction and significant cost savings through enhanced corrosion, diffusion and wear resistance for electronic applications.
  • Diffusion Barrier to intragranular and transgranular metallic contamination and modification. (Cu Migration
  • Better solderability
  • Thickness Reduction:
    • 35% to 75% precious metal plating cost reduction with reduced thickness – produces equal or better performance


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