SAMs Process – Self Assembled Molecules

What is the SAM’s process and the benefits?

• A surface treatment (Post Plate) that forms a protective layer of “Self Assembled Molecules” on Gold, Silver and other plated surfaces.

• Precious metal thickness reduction and significant cost savings through enhanced corrosion, diffusion and wear resistance for electronic applications.
• Diffusion Barrier to intragranular and transgranular metallic contamination and modification. (Cu Migration

• Better solderability
• Thickness Reduction:
  • 35% to 75% precious metal plating cost reduction with reduced thickness – produces equal or better performance